1. ULungiselelo lweSubstrate: Khetha umgangatho ophezulu-we-FR4 PCB substrate njengenxalenye engaphantsi.
2. Unyango lwe-Surface: Ukusika, ukubhola, ukupholisa imichiza, njl.
3. Ushicilelo oluncamathelayo: Shicilela umaleko wokuncamathelisa kumphezulu we-PCB usebenzisa isikrini sesilika okanye ushicilelo lwesikrini.
4. Ukufakwa: Faka izixhobo ze-elektroniki kwi-adhesive layer ngokuhambelana nepateni ye-SMD.
5. Ukunyanga: Sebenzisa isibane se-UV ukukhusela i-adhesive layer kunye nezixhobo ze-elektroniki kumphezulu we-PCB.
6. UKutyabeka komphezulu: Sebenzisa umatshini wokugquma wokutshiza ukuze usebenzise umaleko ochasene{1}}ne-oxidation kumphezulu we-PCB ukunqanda i-oxidation kunye nokuhlwa.
